Recently worked on an interesting high-performance copper heatsink prototype that combines skived fins or zipper fins with integrated heat pipes.
The design uses densely packed skived copper fins for maximum surface area and efficient airflow, while the heat pipes help spread heat quickly from the base to the fin stack. This approach allows for better thermal performance in compact, high-power applications—like servers, GPUs, or industrial electronics—without relying solely on larger extrusions or vapor chambers.
I always find it fascinating how small refinements in material processing and pipe layout can meaningfully improve heat dissipation while keeping weight and cost reasonable.
What are your go-to techniques for balancing performance and manufacturability in thermal designs? I'd love to hear your thoughts!